Optimization of the Plated Through Hole (PTH) process by the combinationof design of experiments and response surface methodology

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Optimization of the Plated Through Hole (PTH) process by the combinationof design of experiments and response surface methodology

 

Author: Shew, Yun-wan
Title: Optimization of the Plated Through Hole (PTH) process by the combinationof design of experiments and response surface methodology
Degree: M.Sc.
Year: 2001
Subject: Printed circuits -- Design and construction
Hong Kong Polytechnic University -- Dissertations
Department: Multi-disciplinary Studies
Dept. of Manufacturing Engineering
Pages: ix, 127 leaves : ill. ; 30 cm
Language: English
InnoPac Record: http://library.polyu.edu.hk/record=b1599597
URI: http://theses.lib.polyu.edu.hk/handle/200/1053
Abstract: A 25-1v fractional factorial design is selected to screen out the significant factors as well as their interactions on the response of copper deposition rate of a Plated Through Hole (PTH) process, i.e. location effects. In adopting a fractional factorial design, the higher-order interactions are assumed negligible. The location factors screened out are operation time, temperature, concentration of copper additive and the interaction of time and temperature. A normal probability plot of the residuals is used to determine the factors give the minimum thickness variability of the PTH process, i.e. dispersion effects. The interaction of time and temperature is the only dispersion effect identified. Model adequacy checking is conducted to check the normality, independence and constant variance assumptions of the model. The model roughly satisfied the required assumptions with certain errors induced. Operation time and temperature are the identified dispersion factors. Hence Response Surface Methodology is adopted to locate the optimal operating point within the process window of these two factors. Firstly a first-order model is regressed on the standard deviation of thickness of the four corners of the process window. The path of steepest descent is found based on the first-order model. A new first-order is then regressed at the point no further decrease in response is observed. The lack of fit of the new first-order model indicates that a second-order model is needed. A Central Composite Design (CCD) is selected to regress the second-order model. The stationary point obtained by the partial differentiation of the second-order model is 10.623 minutes in operation time and 24 C in temperature. The stationary point is characterized by Canonical Analysis to be a minimum point. The predicted minimum variation of copper deposition rate calculated based on the second-order model is 1.02u".

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