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DC FieldValueLanguage
dc.contributorMulti-disciplinary Studiesen_US
dc.contributorDepartment of Manufacturing Engineeringen_US
dc.creatorShew, Yun-wan-
dc.identifier.urihttps://theses.lib.polyu.edu.hk/handle/200/1053-
dc.languageEnglishen_US
dc.publisherHong Kong Polytechnic University-
dc.rightsAll rights reserveden_US
dc.titleOptimization of the Plated Through Hole (PTH) process by the combinationof design of experiments and response surface methodologyen_US
dcterms.abstractA 25-1v fractional factorial design is selected to screen out the significant factors as well as their interactions on the response of copper deposition rate of a Plated Through Hole (PTH) process, i.e. location effects. In adopting a fractional factorial design, the higher-order interactions are assumed negligible. The location factors screened out are operation time, temperature, concentration of copper additive and the interaction of time and temperature. A normal probability plot of the residuals is used to determine the factors give the minimum thickness variability of the PTH process, i.e. dispersion effects. The interaction of time and temperature is the only dispersion effect identified. Model adequacy checking is conducted to check the normality, independence and constant variance assumptions of the model. The model roughly satisfied the required assumptions with certain errors induced. Operation time and temperature are the identified dispersion factors. Hence Response Surface Methodology is adopted to locate the optimal operating point within the process window of these two factors. Firstly a first-order model is regressed on the standard deviation of thickness of the four corners of the process window. The path of steepest descent is found based on the first-order model. A new first-order is then regressed at the point no further decrease in response is observed. The lack of fit of the new first-order model indicates that a second-order model is needed. A Central Composite Design (CCD) is selected to regress the second-order model. The stationary point obtained by the partial differentiation of the second-order model is 10.623 minutes in operation time and 24 C in temperature. The stationary point is characterized by Canonical Analysis to be a minimum point. The predicted minimum variation of copper deposition rate calculated based on the second-order model is 1.02u".en_US
dcterms.extentix, 127 leaves : ill. ; 30 cmen_US
dcterms.isPartOfPolyU Electronic Thesesen_US
dcterms.issued2001en_US
dcterms.educationalLevelAll Masteren_US
dcterms.educationalLevelM.Sc.en_US
dcterms.LCSHPrinted circuits -- Design and constructionen_US
dcterms.LCSHHong Kong Polytechnic University -- Dissertationsen_US
dcterms.accessRightsrestricted accessen_US

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Please use this identifier to cite or link to this item: https://theses.lib.polyu.edu.hk/handle/200/1053