Characterization of new glass fibre reinforced modified bismaleimide composites

Pao Yue-kong Library Electronic Theses Database

Characterization of new glass fibre reinforced modified bismaleimide composites

 

Author: Ng, Yeung-fat
Title: Characterization of new glass fibre reinforced modified bismaleimide composites
Degree: M.Sc.
Year: 1998
Subject: Glass reinforced plastics
Fiber reinforced plastics
Fibrous composites
Hong Kong Polytechnic University -- Dissertations
Department: Multi-disciplinary Studies
Dept. of Applied Physics
Pages: xv, 119 leaves : ill. (some col.) ; 30 cm
Language: English
InnoPac Record: http://library.polyu.edu.hk/record=b1463704
URI: http://theses.lib.polyu.edu.hk/handle/200/1447
Abstract: A new modified bismaleimide-glass fibre (5MBMI-GF) composite was developed and investigated for use as printed circuit board material. Its electrical, thermal, mechanical and other physical properties were tested. Compared with the conventional FR4 epoxy-glass fibre (epoxy-GF) composites, the 5MBMI-GF composite is significantly higher in volume resistivity and lower in thermal conductivity and Z-expansion. The glass transition temperature of this new composite is very high and its operating temperature is 200 C which is higher than that of other laminated materials. The 5MBMI-GF composite is a brittle material with low water absorption of 0.28 %. The bending strength, Young's modulus and volume resistivity of this brittle composite decrease with increasing temperature because the new modified bismaleimide (5MBMI) resin is softened at high temperature. However, the dielectric constant of the 5MBMI-GF composite increases with temperature. Overall, the 5MBMI-GF composite is a new material with better heat-resistance, higher electrical resistivity and lower water absorption. Therefore, this new modified composite is suitable to be further developed as high-temperature printed circuit board substrate.

Files in this item

Files Size Format
b14637042.pdf 14.88Mb PDF
Copyright Undertaking
As a bona fide Library user, I declare that:
  1. I will abide by the rules and legal ordinances governing copyright regarding the use of the Database.
  2. I will use the Database for the purpose of my research or private study only and not for circulation or further reproduction or any other purpose.
  3. I agree to indemnify and hold the University harmless from and against any loss, damage, cost, liability or expenses arising from copyright infringement or unauthorized usage.
By downloading any item(s) listed above, you acknowledge that you have read and understood the copyright undertaking as stated above, and agree to be bound by all of its terms.

     

Quick Search

Browse

More Information