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dc.contributorMulti-disciplinary Studiesen_US
dc.contributorDepartment of Applied Physicsen_US
dc.creatorNg, Yeung-fat-
dc.identifier.urihttps://theses.lib.polyu.edu.hk/handle/200/1447-
dc.languageEnglishen_US
dc.publisherHong Kong Polytechnic University-
dc.rightsAll rights reserveden_US
dc.titleCharacterization of new glass fibre reinforced modified bismaleimide compositesen_US
dcterms.abstractA new modified bismaleimide-glass fibre (5MBMI-GF) composite was developed and investigated for use as printed circuit board material. Its electrical, thermal, mechanical and other physical properties were tested. Compared with the conventional FR4 epoxy-glass fibre (epoxy-GF) composites, the 5MBMI-GF composite is significantly higher in volume resistivity and lower in thermal conductivity and Z-expansion. The glass transition temperature of this new composite is very high and its operating temperature is 200 C which is higher than that of other laminated materials. The 5MBMI-GF composite is a brittle material with low water absorption of 0.28 %. The bending strength, Young's modulus and volume resistivity of this brittle composite decrease with increasing temperature because the new modified bismaleimide (5MBMI) resin is softened at high temperature. However, the dielectric constant of the 5MBMI-GF composite increases with temperature. Overall, the 5MBMI-GF composite is a new material with better heat-resistance, higher electrical resistivity and lower water absorption. Therefore, this new modified composite is suitable to be further developed as high-temperature printed circuit board substrate.en_US
dcterms.extentxv, 119 leaves : ill. (some col.) ; 30 cmen_US
dcterms.isPartOfPolyU Electronic Thesesen_US
dcterms.issued1998en_US
dcterms.educationalLevelAll Masteren_US
dcterms.educationalLevelM.Sc.en_US
dcterms.LCSHGlass reinforced plasticsen_US
dcterms.LCSHFiber reinforced plasticsen_US
dcterms.LCSHFibrous compositesen_US
dcterms.LCSHHong Kong Polytechnic University -- Dissertationsen_US
dcterms.accessRightsrestricted accessen_US

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Please use this identifier to cite or link to this item: https://theses.lib.polyu.edu.hk/handle/200/1447