Author: Cheung, Wing-wai Daniel
Title: A study of the shearing behaviour of ball grid array, BGA in singulation
Degree: M.Sc.
Year: 1998
Subject: Ball grid array technology
Taguchi methods (Quality control)
Hong Kong Polytechnic University -- Dissertations
Department: Multi-disciplinary Studies
Pages: ix, 126 leaves : ill. ; 30 cm
Language: English
Abstract: Cost down is the most common slogan of nowadays semiconductor manufacturers. Productivity is always the major concern in equipment selection but this is not to say that quality can be neglected or of lesser importance. BGA is a new packaging technology which requires different processes and production equipment. Singulation of a BGA unit from a substrate strip is the last assembly operation but not the least technology know-how. On the contrary, more attention has to be paid as it is the last operation and any damage will ruin all the predecessor processes. In fact, there are quite a number of methods could be used for BGA singulation. Blanking is one of the most widely accepted methods in industry in the sense of optimum solution of productivity and quality. Microcrack and burr length are the usual quality characteristics which the semiconductor manufacturers concerning. Factors affect these two quality characteristics could be many. Taguchi methods could help in identifying and classifying the various factors into degree of significance and effects at the minimum time and cost. Throughout this study, the optimum settings regarding the selected controlling factors for BGA singulation by blanking method are obtained. The significance of the noise factors to the quality characteristics in concern, microcrack and burr length is recognized. The advantages and power of Taguchi methods in designing of experiment, DOE are appreciated. Limitation and disadvantages of Taguchi methods are also understood.
Rights: All rights reserved
Access: restricted access

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