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DC FieldValueLanguage
dc.contributorMulti-disciplinary Studiesen_US
dc.creatorSo, Chi-kuen-
dc.identifier.urihttps://theses.lib.polyu.edu.hk/handle/200/4028-
dc.languageEnglishen_US
dc.publisherHong Kong Polytechnic University-
dc.rightsAll rights reserveden_US
dc.titleA study of the electrodeposition of iron by pulsed currenten_US
dcterms.abstractIn electroplating with direct current (dc), one can only control the plating bath by a limited number of parameters. Recently, there is an increasing interest in the use of pulse plating by allowing current or voltage to be applied as almost any function of time. The idea of using pulsed current is to utilize the current characteristics rather than the chemistry to control the properties of deposits for certain applications. The current characteristics include the on-time, off-time and the pulsed current density. In the case of pulse reverse (PR) plating, the reverse pulsed current density can also be considered. In this project, iron was electroplated on brass substrate by the application of pulsed current. The microhardness of the deposits were examined by the use of microhardness tester. The current efficiency was also investigated by measuring the difference in weight before and after the plating process. It is found that the microhardness of the iron deposit is improved, the brightness of the surface is improved and the current efficiency is reduced with pulse plating. Satisfactory pulse conditions on electrodeposition of iron based on microhardness have also been established. The condition is on-time at 1ms, off-time at 8ms and average current density at 2.08A/dm2.en_US
dcterms.extentiv, 90 leaves : ill. (some col.) ; 30 cmen_US
dcterms.isPartOfPolyU Electronic Thesesen_US
dcterms.issued1994en_US
dcterms.educationalLevelAll Masteren_US
dcterms.educationalLevelM.Sc.en_US
dcterms.LCSHIron platingen_US
dcterms.LCSHPulse platingen_US
dcterms.LCSHElectroplatingen_US
dcterms.LCSHHong Kong Polytechnic -- Dissertationsen_US
dcterms.accessRightsrestricted accessen_US

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