| Author: | Leung, Kuen Ivan |
| Title: | Study on reflow soldering process using combined IR and convectional heating |
| Degree: | M.Sc. |
| Year: | 1996 |
| Subject: | Solder and soldering Surface mount technology Hong Kong Polytechnic University -- Dissertations |
| Department: | Multi-disciplinary Studies |
| Pages: | 59 leaves : ill. ; 30 cm |
| Language: | English |
| Abstract: | In order to achieve good solderability and prevent vulnerable components,such as chips, IC's and LSI's, from thermal damage, it is essential to establish optimal heating conditions in reflow soldering process. In the early days of commercial reflow soldering process, majority of the automatic reflow soldering machines in the market employs far infra-red (IR) as the source of heating. However, for some delicated components such as LSI, the IR energy absorb by the encapsulation body will be much higher than that of its leads, causing damage of the components by excessive explosure to heat. Recent reflow soldering equipment develop the use of convectional heating to avoid components damage. A few modern and sophisticated reflow soldering machine employs a combination of IR and convectonal heating to overcome the deficiency of each type of heating method [1]. This project is initiated by the needs of my company, as an electronic processing equipment manufacturer, to develop an effective and efficient method of heating for reflow soldering of surface mount components. The study is focused on the ability of the heating method in ensuring minimum thermal damage on delicated electronic components whilst carrying out the reflow process within competitive speed and economy. Experimental investigation had been conducted with different combination of IR and convectional heating, using a prototype oven modified from the existing equipment. Heating characteristic on the selected components had been recorded and analysed. Further attempt had been made to improve heating characteristics by thermal shielding and IR reflective painting. The result of the investigation has confirmed the effectiveness of using a combination of IR and locallized conventional heating at the soldering zone. Thermal shielding has also been proven to be very effective on certain components. |
| Rights: | All rights reserved |
| Access: | restricted access |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| b12306964.pdf | For All Users (off-campus access for PolyU Staff & Students only) | 2.75 MB | Adobe PDF | View/Open |
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