Development of a simulation model for predicting settling time and motor lock time of wire bonder used in semiconductor industry

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Development of a simulation model for predicting settling time and motor lock time of wire bonder used in semiconductor industry

 

Author: Chan, Keung-key
Title: Development of a simulation model for predicting settling time and motor lock time of wire bonder used in semiconductor industry
Degree: M.Sc.
Year: 1996
Subject: Semiconductors -- Bonding -- Simulation methods
Hong Kong Polytechnic University -- Dissertations
Department: Multi-disciplinary Studies
Pages: xv, 135 leaves : ill. ; 30 cm
Language: English
InnoPac Record: http://library.polyu.edu.hk/record=b1230690
URI: http://theses.lib.polyu.edu.hk/handle/200/717
Abstract: The semiconductor industry demands high quality wire bonder with short lead time. The simulation has been proved to be a major tool of design in industry to improve the design efficiency. There is a need for building the simulation model to facilitate the design of wire bonder. The objective of the development of simulation model of the wire bonder is to reduce the product development time and quickly respond to customer requirements. The simulation model will be valuable in assessing the design in the early stage and reducing the modifications in subsequent design. Any design changes in the latter stage are accompanied by heavy penalties in terms of time and cost. The dissertation describes the procedures involving in developing the simulation model. To reflect the reality, the static friction, coulomb friction and stiffness of components are taken into account. Six body model of mechanical system is developed. The simulation model consists of mechanical element block, friction block, motor and controller block. The simpler models, three body model and rigid body model, are also developed to see whether they can be a good approximation to six body model or not. MATLAB is used to simulate the electromechanical system of wire bonder. Six body model is employed throughout the simulation. A triangular velocity profile is inputted to a X-Y table of stroke 2.l"(X) x 2.3"(Y) and the effects of coulomb friction on machine performance are investigated. The data obtained by different values of coulomb friction is compared with the experimental results. The transient responses of the machine are presented. The combination of static friction and coulomb friction best fitting the experimental result is chosen for subsequent study. The simulation results using different integration algorithm are compared. The effect of changing mass of bonder, the stiffness of load, the stiffness of coupling, static friction and coulomb friction are also investigated. The settling time and motor lock time obtained by six body model, three body model and rigid body model are compared. The simulation model of six body model is then used to determine the settling time and motor lock time of the designed wire bonder of longer stroke of 4 inch (X) x 4 inch (Y) (100mm (X) x 100mm (Y)). Some modifications of the X-Y table design are proposed. Finally, future improvements to the simulation model are discussed.

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