Author: Ng, Yeung-fat
Title: Characterization of new glass fibre reinforced modified bismaleimide composites
Degree: M.Sc.
Year: 1998
Subject: Glass reinforced plastics
Fiber reinforced plastics
Fibrous composites
Hong Kong Polytechnic University -- Dissertations
Department: Multi-disciplinary Studies
Department of Applied Physics
Pages: xv, 119 leaves : ill. (some col.) ; 30 cm
Language: English
Abstract: A new modified bismaleimide-glass fibre (5MBMI-GF) composite was developed and investigated for use as printed circuit board material. Its electrical, thermal, mechanical and other physical properties were tested. Compared with the conventional FR4 epoxy-glass fibre (epoxy-GF) composites, the 5MBMI-GF composite is significantly higher in volume resistivity and lower in thermal conductivity and Z-expansion. The glass transition temperature of this new composite is very high and its operating temperature is 200 C which is higher than that of other laminated materials. The 5MBMI-GF composite is a brittle material with low water absorption of 0.28 %. The bending strength, Young's modulus and volume resistivity of this brittle composite decrease with increasing temperature because the new modified bismaleimide (5MBMI) resin is softened at high temperature. However, the dielectric constant of the 5MBMI-GF composite increases with temperature. Overall, the 5MBMI-GF composite is a new material with better heat-resistance, higher electrical resistivity and lower water absorption. Therefore, this new modified composite is suitable to be further developed as high-temperature printed circuit board substrate.
Rights: All rights reserved
Access: restricted access

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