| Author: | Ng, Yeung-fat |
| Title: | Characterization of new glass fibre reinforced modified bismaleimide composites |
| Degree: | M.Sc. |
| Year: | 1998 |
| Subject: | Glass reinforced plastics Fiber reinforced plastics Fibrous composites Hong Kong Polytechnic University -- Dissertations |
| Department: | Multi-disciplinary Studies Department of Applied Physics |
| Pages: | xv, 119 leaves : ill. (some col.) ; 30 cm |
| Language: | English |
| Abstract: | A new modified bismaleimide-glass fibre (5MBMI-GF) composite was developed and investigated for use as printed circuit board material. Its electrical, thermal, mechanical and other physical properties were tested. Compared with the conventional FR4 epoxy-glass fibre (epoxy-GF) composites, the 5MBMI-GF composite is significantly higher in volume resistivity and lower in thermal conductivity and Z-expansion. The glass transition temperature of this new composite is very high and its operating temperature is 200 C which is higher than that of other laminated materials. The 5MBMI-GF composite is a brittle material with low water absorption of 0.28 %. The bending strength, Young's modulus and volume resistivity of this brittle composite decrease with increasing temperature because the new modified bismaleimide (5MBMI) resin is softened at high temperature. However, the dielectric constant of the 5MBMI-GF composite increases with temperature. Overall, the 5MBMI-GF composite is a new material with better heat-resistance, higher electrical resistivity and lower water absorption. Therefore, this new modified composite is suitable to be further developed as high-temperature printed circuit board substrate. |
| Rights: | All rights reserved |
| Access: | restricted access |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| b14637042.pdf | For All Users (off-campus access for PolyU Staff & Students only) | 14.53 MB | Adobe PDF | View/Open |
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