Full metadata record
|dc.contributor||Department of Manufacturing Engineering||en_US|
|dc.publisher||Hong Kong Polytechnic University||-|
|dc.rights||All rights reserved||en_US|
|dc.title||The development of flexible business process reengineering in PCB manufacturing||en_US|
|dcterms.abstract||The new management concept of Flexible Business Process Reengineering (FBPR) is developed by a combination of three management tools-Positioning, Continuous Improvement and Business Process Reengineering (PIR). By combining and employing the three management tools, it forms a complete management concept rather than solely continuous improvement or reengineering. However, the changes could be slightly less "radical" than the conventional BPR, but in exchange, it is relatively less risk-taking and can facilitate continuous learning and improvement. The objective of this research is to increase the productivity and to decrease the Through-Put-Time (TPT) of a Printed Circuit Board (PCB) manufacturing company located in Hong Kong through the use of both linear and non-linear improvement scheme of FBPR. In this research, a Value Delivery System (VDS) is developed to provide a systematic approach for project implementation. A number of supporting tools such as strategic planning, performance analysis, action description table, relational diagram, process decomposition, analysis development, preventive analysis, Design Of Experiment (DOE), benchmarking, prototype testing, computer simulation model and process analysis are utilized to accelerate the effectiveness of FBPR. The implementation of the FBPR is presented in three independent case studies, the process level, the operational level and the organizational level. The process level is considered to be the least complex during the implementation and the organizational level is considered to be the most complex. The scope of process-level FBPR is limited to within a process. Therefore, its degree and course of improvement is considered linear. In contrast, the scope of organizational-level FBPR has extended to the whole organization. Due to its high complexity and extensive target of enhancement, the degree and course of improvement is considered non-linear. The first case study is to apply process-level FBPR on the silkscreen printing process to linearly improve its productivity and its TPT. Two additional supporting tools, action description table and relational diagram are utilized. Action description table is used to illustrate the value adding and non-value adding activities. Relational diagram is used to illustrate the workflow of the activities. The result of this project shows an average of greater than 30% increase on both the productivity and the TPT of the silkscreen printing process. The second case study is to apply operational-level FBPR on the post-Hot-Air-Solder-Leveling (post-HASL) baking operation. The objective of this project is to eliminate the entire post-HASL baking operation so as to reduce this non-value adding operation and to promote the concept of preventive action. The post-HASL baking operation, as a corrective action, is used to reduce the ionic contamination created from the former operations such as the solder masking operation and HASL operation. Two additional supporting tools, process decomposition and analysis development, are used to identify the root cause of the ionic contamination. The result of this project shows that the entire post-HASL operation is eliminated. This reduced the total TPT, increased the quality of product, and reduced the possibility of making manual errors. The third case study is to apply organizational-level FBPR in redesigning the PCB panel size. This project aimed to improve the total manufacturing TPT, decrease the quality variances, and decrease the total production cost. A number of supporting tools, such as DOE, benchmarking, prototype testing, computer simulation model and process analysis, are used to control and monitor changes. The result of this project shows that the productivity of various manufacturing operations has increased up to 25% and 103%.||en_US|
|dcterms.extent||xiv, 141 leaves : ill. ; 30 cm||en_US|
|dcterms.isPartOf||PolyU Electronic Theses||en_US|
|dcterms.LCSH||Printed circuits industry -- China -- Hong Kong -- Management||en_US|
|dcterms.LCSH||Reengineering (Management) -- China -- Hong Kong||en_US|
|dcterms.LCSH||Hong Kong Polytechnic University -- Dissertations||en_US|
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